TECBOND™ 7785

High temperature and chemical resistant multi-purpose polyamide adhesive.

  • Reference: TECBOND® 7785

  • Open Time: Medium

  • Chemistry: Polyamide

  • Heat Resistant To: 135 °C

  • Low Temp Flex: -10 °C

  • Viscosity: Medium

  • Links: 12mm15mm43mmCT

SUPPORTING FILES SIZE DATE
Safety Data Sheet 398.59 kB 8th August 2021
Substrate Score
FLEXIBLE PVC 8
HARD WOOD 7
SAND MOLD 7
POLYSTYRENE 6
SOFT WOOD 6
CARDBOARD 6
ABS 4
POLYCARBONATE 4
RIGID PVC 4
GRP 4
ALUMINIUM 4
STAINLESS STEEL 4
PU FOAM 4
LDPE 2
HDPE 2
POLYPROPYLENE 2
EXPANDED POLYSTYRENE 2
GLASS 2
UV VARNISH 2