TECBOND™ 7718

Coloured, low viscosity, potting, encapsulation, and knot-filling / wood repair polyamide adhesive.

  • Reference: TECBOND® 7718

  • Open Time: Short

  • Chemistry: Polyamide

  • Heat Resistant To: 135 °C

  • Low Temp Flex: -10 °C

  • Viscosity: Low

  • Links: 12mm15mm43mmCT

SUPPORTING FILES SIZE DATE
Safety Data Sheet 398.8 kB 8th August 2021
Substrate Score
SAND MOLD 7
POLYSTYRENE 6
CARDBOARD 6
ABS 4
RIGID PVC 4
FLEXIBLE PVC 4
GRP 4
ALUMINIUM 4
STAINLESS STEEL 4
SOFT WOOD 4
HARD WOOD 4
PU FOAM 4
LDPE 2
HDPE 2
POLYCARBONATE 2
POLYPROPYLENE 2
EXPANDED POLYSTYRENE 2
GLASS 2
UV VARNISH 2