TECBOND™ 1X

Low viscosity, wood working and packaging adhesive.

  • Reference: TECBOND® 1X

  • Open Time: Medium

  • Chemistry: EVA

  • Heat Resistant To: 75 °C

  • Low Temp Flex: -20 °C

  • Viscosity: Medium

  • Links: 12mm15mm43mmCT

SUPPORTING FILES SIZE DATE
Safety Data Sheet 398.94 kB 8th August 2021
Substrate Score
CARDBOARD 7
GRP 6
SOFT WOOD 6
HARD WOOD 6
SAND MOLD 6
POLYSTYRENE 4
ALUMINIUM 4
STAINLESS STEEL 4
EXPANDED POLYSTYRENE 4
GLASS 4
ABS 2
LDPE 2
HDPE 2
POLYCARBONATE 2
POLYPROPYLENE 2
RIGID PVC 2
FLEXIBLE PVC 2
PU FOAM 2
UV VARNISH 2

ABS

LDPE

HDPE

POLYCARBONATE

POLYPROPYLENE

POLYSTYRENE

RIGID PVC

FLEXIBLE PVC

GRP

ALUMINIUM

STAINLESS STEEL

EXPANDED POLYSTYRENE

SOFT WOOD

HARD WOOD

SAND MOLD

GLASS

CARDBOARD

PU FOAM

UV VARNISH